Thickness: 1/4OZ～20OZ(9µm～70µm) Width: 550mm ～1295mm
The product has excellent room temperature storage performance, high temperature oxidation resistance performance, product quality to meet the IPC-4562 standard Ⅱ, Ⅲ level requirements.
| Classification | Unit | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu Content | % | ≥99.8 | ||||||
| Area Weigth | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Tensile Strength | R.T.(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| H.T.(180℃) | ≥15 | |||||||
| Elongation | R.T.(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| H.T.(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Roughness | Shiny(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Peel Strength | R.T.(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Change of color(E-1.0hr/190℃) | % | Good | ||||||
| Solder Floating 290℃ | Sec. | ≥20 | ||||||
| Pinhole | EA | Zero | ||||||
| Preperg | ---- | FR-4 | ||||||
Suitable for all kinds of resin system of double-sided, multilayer printed circuit board